Semiconductor Equipment Manufacturer, Yield Engineering Systems, Inc. (YES), Exhibiting at Wafer Level Packaging Trade Show

Livermore, CA (PRWEB) March 26, 2012

Yield Engineering Systems, Inc. (YES), a semiconductor equipment manufacturer, announced today that they will be exhibiting at The 62nd Electronic Components and Technology Conference (ECTC) being held at the Sheraton San Diego Hotel & Marina May 30-31, 2012.

YES manufactures a wide variety of processing equipment including high reliability polymer processing tools for Wafer Level Packaging (WLP) type processes and plasma systems for underfill treatment.

The YES-VertaCure Series and the YES-450PB-HV (High Vac) provide a critical component which allows a degas and moisture abatement process for devices, getters/lids in a single tool. The tools use high temperature and high vacuum to achieve complete moisture removal.

“When creating a high-reliability MEMS package, it is imperative to have complete moisture removal and moisture prevention to extend the life of the MEMS device,” said Bill Moffat, Founder and CEO, “Our tools help you achieve those goals.”

For more information regarding the YES-VertaVac or YES-450PB-HV, visit or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.

About Yield Engineering Systems, Inc.

YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, FPD, MEMS, medical, nanotech industries and more.

They manufacture high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.

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