Livermore, CA (PRWEB) September 28, 2012
Yield Engineering Systems, Inc. (YES), a semiconductor equipment manufacturer, announced today that they have received a patent from the United States Patent & Trademark Office for their vapor deposition system, the YES-1224P.
YES manufactures a wide variety of processing equipment including RDL automated systems, vacuum cure ovens and the newly patented YES-1224P vapor deposition system. This innovative tool provides total environmental control over the deposition process and provides a superior silane/substrate bond that is stable after exposure to atmospheric moisture.
“Getting this patent approved further increases the value and importance of our YES-1224P,” said Bill Moffat, Founder and CEO of YES, “Our tool is state-of-the-art and there is an additional patent for the YES-1224P in the works.”
YES was issued Patent Number US 8,252,375 B2 for the tool and was created by four YES employees including William (Bill) Moffat, Boris Randazzo, Craig McCoy and Stuart Allen.
For more information regarding the YES-1224P, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, FPD, MEMS, medical, nanotech industries and more.
They manufacture high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.